Remember BGA
Full name: Ball Grid Array
Memory aid: Balls form a Grid Under the chip as a cue.
BGA attachment usually requires specialized equipment for rework.
Study area: Processors & system architecture · Batch 6
Relevant study for: CompTIA A+ Core 1 220-1201 · CompTIA Server+
Practice with exam flashcards →Hardware & Components / Knowledge library
BGA — Ball Grid Array
Packages an integrated circuit using an array of solder-ball connections.
Why learn BGA — Ball Grid Array?
Packages an integrated circuit using an array of solder-ball connections.
Where it came from
BGA attachment usually requires specialized equipment for rework.
- Memory aid (a learning cue, not the expansion): Balls form a Grid Under the chip as a cue.
Build your understanding
Work through these exercises in order. Try the task before opening a reference.
- Without looking, expand BGA: Ball Grid Array.
- Recall this memory aid: Balls form a Grid Under the chip as a cue.
- Explain the practical use: Packages an integrated circuit using an array of solder-ball connections.
- Explain this distinction: BGA attachment usually requires specialized equipment for rework.
- Identify BGA in a device specification, architecture diagram, or system inventory.
Documentation and sources
- Intel processor documentation (www.intel.com)